Based on your input data (schematic, bill of materials, mechanical constraints, chip technology), we can design the definition file for the substrate(s) used in your product:
- Modules
- Hybrids
- Macro-components
- Etc
By substrate we mean any type of technology suitable for transferring chips and components, such as:
- Thick-film ceramic substrate (low-frequency or power hybrids)
- Thin-film ceramic substrate (radio-frequency or microwave hybrids)
- Organic substrates (IC-Substrate PCB ) with a minimum isolation distance of 50µm
- Metal lead-frame for integration of QFN, LQFP, System In Package
These services are carried out using CAD tools for boards or substrates, and can include validation by calculation and/or multi-physics simulation (thermal, mechanical, radiation, EMC).
These developments take account of DFM/DFT imperatives, and take into account our assembly rules for implementation, as well as the drawing rules of our qualified suppliers for organic substrates (European suppliers) and for leadframes.