SERMA MICROELECTRONICS conducts packaging studies. This involves “encasing” the product’s design and bill of materials while adhering to mechanical constraints such as volume, support devices, interface, external connectivity, or finishing. These tasks are carried out using 3D CAD software and can include validation through calculations and/or multiphysics simulations (thermal, mechanical, radiation, EMC).
The addressed issues:
- Internal arrangement of the product (shape and surface of substrates, partitioning, integration)
- Internal and external connectivity / Hermeticity
- Compliance with environmental requirements (salt spray, shocks/vibrations, temperature range, EMC, etc.)
Additionally, SERMA MICROELECTRONICS designs in-house the necessary tooling for the production of components entrusted by its clients, as well as certain packaging solutions needed for parts transit.